| 摘要 |
<p>Provided is an electronic control apparatus mounting structure, which improves heat dissipating characteristics of an electronic component that does not have a heat dissipating structure, and which has excellent mass productivity. An electronic control apparatus of the present invention is configured from: a wiring board that is provided with a through hole; an electronic component, which is mounted on a first surface of the wiring board, and which has lead terminals protruding in one direction, said lead terminals being electrically connected to the wiring board; and a heat dissipating member, which is mounted on a second surface of the wiring board, said second surface being on the reverse side of the first surface, and which is attached in a state wherein the heat dissipating member faces the electronic component and the through hole. The electronic control apparatus is provided with: a heat dissipating adhesive material covering the lead terminals of the electronic component; and a filling material, with which the through hole is filled, said filling material having high heat conductivity. The heat dissipating adhesive material is in contact with the filling material, and furthermore, a heat dissipating path from the lead terminals to the heat dissipating member is provided by bringing the heat dissipating adhesive material into thermally contact with the heat dissipating member.</p> |
