| 摘要 |
An embodiment of the present invention relates to an integrated silicone for protecting an electronic device, a circuit module using the same, and a manufacturing method thereof. A technical problem to be solved is to provide an integrated silicone for protecting an electronic device, which has a function of protecting conformal, thermal conductivity, and static electricity and provides a hardening time within 60 seconds, a circuit module using the same, and a manufacturing method thereof. To this end, disclosed is the integrated silicone for protecting an electronic device comprising: a base resin which is at least one element selected from the group consisting of monomer and oligomer; a heat initiator; and a light initiator. In addition, disclosed is the circuit module comprising: a printed circuit board having a plurality of circuit patterns formed on an insulating layer; and the integrated silicone which includes a plurality of electronic devices electrically connected to the circuit patterns by a solder and is coated and hardened on at least one of the circuit patterns, the solder, and the electronic devices. Moreover, disclosed is the manufacturing method of the circuit module comprising the steps of: including a printed circuit board having a plurality of circuit patterns formed on an insulating layer and electrically connecting a plurality of electronic devices to the circuit patterns; coating the integrated silicone on at least one of the circuit patterns, the solder, and the electronic devices; and hardening the integrated silicone using light and heat. |
