| 发明名称 |
HEAT DISSIPATING DEVICE |
| 摘要 |
A heat dissipating device includes a base and a heat dissipating fin. The base includes an accommodating recess formed thereon. The heat dissipating fin includes a heat dissipating portion and a fixing portion, wherein the heat dissipating portion extends from the fixing portion, and the fixing portion has a first recess structure. The base and the heat dissipating fin are combined with each other by a punching process, such that the fixing portion is fixed in the accommodating recess in a tight-fitting manner and a first side wall of the accommodating recess is embedded in the first recess structure. |
| 申请公布号 |
US2015144301(A1) |
申请公布日期 |
2015.05.28 |
| 申请号 |
US201414503377 |
申请日期 |
2014.09.30 |
| 申请人 |
Cooler Master (Hui Zhou) Co., Ltd. |
发明人 |
Lin Chia-Yu;Song Tao |
| 分类号 |
H05K7/20;F28F3/00 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A heat dissipating device comprising:
a base comprising an accommodating recess formed thereon; and a heat dissipating fin comprising a heat dissipating portion and a fixing portion, the heat dissipating portion extending from the fixing portion, the fixing portion having a first recess structure, the base and the heat dissipating fin being combined with each other by a punching process, such that the fixing portion is fixed in the accommodating recess in a tight-fitting manner and a first side wall of the accommodating recess is embedded in the first recess structure. |
| 地址 |
Huizhou CN |
