| 摘要 |
The invention relates to a carrier substrate (102) for a component, in particular a thermoelectric generator (104), wherein the carrier substrate (102) has a heat interface (106), a heat exchanger structure (108), and a thermal conductor (110). The heat interface (106) is configured for thermally contacting the thermoelectric generator (104). The heat exchanger structure (108) is configured to release and/or receive thermal energy. The heat exchanger structure (108) is arranged, at least partially, on the side of the carrier substrate (102) that is opposite of the heat interface (106). The thermal conductor (110) is configured for conducting the thermal energy between the heat interface (106) and the heat exchanger structure (108). |
