ELECTROLESS COPPER PLATING SOLUTION COMPOSITION AND ELECTROLESS COPPER PLATING METHOD USING SAME

摘要

An objective of the present invention is to provide an electroless copper plating solution composition which can improve the stability of the plating solution without using formaldehyde as a reducing agent, and an electroless copper plating method using the same. According to one aspect of the present invention, provided is an electroless copper plating solution composition which does not contain a cyano compound or formaldehyde, but contains at least two selected from a group consisting of derivatives of the aldehydes; a reducing sugar with an aldehyde or ketone group; and phosphate derivatives.