发明名称 COMPONENT PACKAGING MACHINE
摘要 PROBLEM TO BE SOLVED: To integrate power transmission circuits to be provided at the side of a packaging machine body when wirelessly transmitting power from the side of the packaging machine body to a plurality of component supply cassettes into one circuit, in a component packaging machine structured to mount the plurality of component supply cassettes in a cassette mounting part of the packaging machine body while arranging the component supply cassettes in parallel in a width direction.SOLUTION: The component packaging machine includes a packaging machine body 10 for packaging components onto a substrate, and a plurality of component supply cassettes 20 are mounted in a cassette mounting part 11 of the packaging machine body while being arranged in parallel in a width direction. Each of the plurality of component supply cassettes 20 includes a power receiving electrode 22 and in the cassette mounting part 11, a power transmitting electrode 12 is provided that extends in a width direction so as to face the power receiving electrode 22. Power is transmitted from the power transmitting electrode 12 to each of the power receiving electrodes 22 in accordance with an electric field coupling system.
申请公布号 JP2015099877(A) 申请公布日期 2015.05.28
申请号 JP20130240026 申请日期 2013.11.20
申请人 SAMSUNG TECHWIN CO LTD 发明人 OGATA YUJI
分类号 H05K13/02 主分类号 H05K13/02
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