发明名称 TRANSPORT DEVICE FOR RESIN MOLDING
摘要 <p>PROBLEM TO BE SOLVED: To provide a transport device capable of transporting a resin molding to a higher position in spite of a compact structure having a small occupied area.SOLUTION: In a transport device 1,: a resin molding is loaded on a bottom plate 10A in a state that a loading part 10 exists at a bottom dead point and the loading part 10 moves from the bottom dead point to a top dead point when transporting the resin molding; at that time, the resin molding is transported in an obliquely upward direction while preventing the resin molding from falling down from the lower edge side of a bottom plate 10A with the guard surface 17A during movement in a section that the position of the lower edge of the bottom plate 10A is lower than the upper edge of the guard surface 17A; and resin molding is transported to a destination by falling down the resin molding from the lower edge side of the bottom plate 10A to a direction exceeding the upper edge of the guard surface 17A when the lower edge of a bottom plate 10A reaches a position equal to the upper edge of the guard surface 17A or a section upper than the upper edge of the guard surface 17A.</p>
申请公布号 JP2015098372(A) 申请公布日期 2015.05.28
申请号 JP20130237866 申请日期 2013.11.18
申请人 KITAGAWA KOGYO CO LTD 发明人 NISHIDA SHINJI
分类号 B65G25/00;B29C37/00;B65G25/06 主分类号 B65G25/00
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