发明名称 RESIN BONDING APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a resin bonding apparatus which melts plastic pellets in a melter and makes a resin joint between a first member and a second member by a resin melting and injecting device and an adaptor.SOLUTION: The resin bonding apparatus includes a resin melting and injecting device and an adaptor 8. The resin melting and injecting device includes: a cylinder 1 having an outlet member 5 at the leading edge and a plunger 4 on the rear side; driving means 3 for a reciprocating movement; a melter 2 having many melting holes 22 communicating from a large inflow-side opening 22a to a small outflow-side opening 22b in the longitudinal direction of a melter body 21, with a large diameter cylindrical part 22d extending adjacent to an end and the small outflow-side opening 22b only on the outflow side; and heating means 6, allows pellets p as molten resin q to flow in from the large inflow-side opening 22a of the melter 2 by a pressing force from the plunger 4 and to flow out from the small outflow-side opening 22b. The adapter 8 retains the molten resin q injected from the outlet member 5 to at least one side of a first member 91 and a second member 92 to be bonded together with the molten resin q, so that the escape of the molten resin q is prevented.</p>
申请公布号 JP2015098163(A) 申请公布日期 2015.05.28
申请号 JP20140077370 申请日期 2014.04.03
申请人 CENTURY INNOVATION CORP 发明人 KAWASAKI HIROAKI
分类号 B29C45/46;B29C33/12;B29C45/14 主分类号 B29C45/46
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