Packages with Molding Material Forming Steps

摘要

A package includes a first package component having a top surface, a second package component bonded to the top surface of the first package component, and a plurality of electrical connectors at the top surface of the first package component. A molding material is over the first package component and molding the second package component therein. The molding material includes a first portion overlapping the second package component, wherein the first portion includes a first top surface, and a second portion encircling the first portion and molding bottom portions of the plurality of electrical connectors therein. The second portion has a second top surface lower than the first top surface.

主权项

1. A method comprising:
placing a mold chase over a package substrate, wherein the mold chase comprises a recess extending from a bottom surface of the mold chase into the mold chase; pressing the package substrate against a release film placed to the bottom surface of the mold chase and extending into the recess, wherein an upper portion of a solder region at a top surface of the package substrate is pressed into the release film; injecting a molding material into a space between the release film and the package substrate; curing the molding material; and removing the mold chase.