Provided is a dicing tape from which a thin semiconductor chip can be efficiently picked up within a short time without the occurrence of chip cracking during a pick-up step after a dicing step. A dicing tape (1) of the present invention has an adhesive layer that contains 0.5-30 parts by mass of a phthalic acid ester per 100 parts by mass of one or more polymers that are selected from the group consisting of acrylic polymers, vinyl acetate polymers and acrylic-based polymers having a carbon-carbon double bond. The adhesive layer has a peel strength of 0.5 N/25 mm or more before radiation curing, while having a peel strength of 0.05-0.4 N/25 mm after radiation curing. If (i) is the peel strength at a peeling rate of 50 mm/min after radiation curing and (ii) is the peel strength at a peeling rate of 1,000 mm/min after radiation curing, (ii)/(i) is 1 or less.
