发明名称 MRAM Device and Fabrication Method Thereof
摘要 According to an embodiment, a magnetoresistive random access memory (MRAM) device comprises a bottom electrode, a stack, a dielectric material, a dielectric layer, and a conductive material. The bottom electrode is over a substrate, and the stack is over the bottom electrode. The stack comprises a magnetic tunnel junction (MTJ) and a top electrode. The dielectric material is along a sidewall of the stack, and the dielectric material has a height greater than a thickness of the MTJ and less than a stack height. The dielectric layer is over the stack and the dielectric material. The conductive material extends through the dielectric layer to the top electrode of the stack.
申请公布号 US2015147825(A1) 申请公布日期 2015.05.28
申请号 US201414561058 申请日期 2014.12.04
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Sung Fu-Ting;Liu Shih-Chang;Tsai Chia-Shiung
分类号 H01L43/12 主分类号 H01L43/12
代理机构 代理人
主权项 1. A method for forming a magnetoresistive random access memory (MRAM) device, the method comprising: forming a bottom electrode layer on a substrate; forming magnetic tunnel junction (MTJ) layers over the bottom electrode layer; forming a top electrode layer over the MTJ layers; removing portions of the MTJ layers and the top electrode layer to form a stack, the stack comprising remaining portions of the MTJ layers and the top electrode layer, the stack having a sidewall; forming a first dielectric layer over the stack; and removing a portion of the first dielectric layer, a remaining portion of the first dielectric layer adjoining the sidewall of the stack, the remaining portion of the first dielectric layer having a height above a thickness of the MTJ layers and below a thickness of the stack.
地址 Hsin-Chu TW