SOLDERLESS HEARING ASSISTANCE DEVICE ASSEMBLY AND METHOD

摘要

Disclosed herein, among other things, are systems and methods for solderless assembly for hearing assistance devices. One aspect of the present subject matter includes a method of manufacturing a hearing assistance device. According to various embodiments, the method includes providing a molded interconnect device (MID) housing and inserting a flexible circuit module having conductive surface traces into the MID housing. One or more hearing assistance electronic modules are connected to the MID housing using direct compression without the use of wires or solder, according to various embodiments. In one embodiment, the MID housing includes a laser-direct structuring (LDS) housing.

主权项

1. A method of manufacturing a hearing assistance device, the method comprising:
providing a molded interconnect device (MID) housing; inserting a flexible circuit module having conductive surface traces into the MID housing; and connecting one or more hearing assistance electronic modules to the MID housing using direct compression without the use of wires or solder.