INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS HAVING THE SAME

摘要

The present invention provides an insulaton resin composition for a printed circuit board, a prepreg, a copper clad laminate, and a printed circuit board which are manufactured by using the same composition. More specifically, according to an embodiment of the present invention, a curing agent including a bipyridine structure is included in the insulaton resin composition. Therefore, heat-resistant properties, including the glass transition temperature and a coefficient of thermal expansion, and mechanical properties, including separation strength between a metal layer and an insulation layer, are increased.