| 摘要 |
The through-type furnace for a substrate (3) comprises: a feeding system to feed the substrate (3) through a furnace (1) with a channel (2) and the channel (2). The channel (2) is bounded by a base (4), a front wall (5), a rear wall (6), and an upper part (7). The base (4) comprises a plurality of first hole (8) connectable to a protective gas source (9) such that the protective gas can be supplied during operation. The front wall (5) of the channel (2) comprises a longitudinal slit (11) extending parallel to the pass direction (10) and bounded by a bottom edge (12) and an upper edge (13). The feeding system comprises at least one clamp (15) to feed the substrate (3) through the channel (2). The clamp (15) is movable back and forth along a longitudinal slit (11) of the channel (2). Such a through-type furnace is particularly suitable for use in soft solder die bonder. |
