| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board and an electronic apparatus, in which an electronic component and the like has high connection reliability.SOLUTION: A wiring board comprises: an insulating substrate 1; a first conductor layer 2A provided on a first principal surface of the insulating substrate 1; and a first plating layer 3 which covers the first conductor layer 2A. The first plating layer 3 is a wiring board 4 which includes a nickel-cobalt plating layer 3a, a palladium-cobalt alloy plating layer 3b and a gold plating layer 3c which are sequentially deposited from a surface of the first conductor layer 2A. The palladium-cobalt alloy plating layer 3b inhibits diffusion of a nickel component to the gold plating layer 3c and alloying (solid solution formation) with cobalt inhibits diffusion of palladium to the gold plating layer 3c. |
