| 发明名称 |
DEVICE AND METHOD FOR CUTTING SUBSTRATE |
| 摘要 |
A substrate cutting device in accordance with the present invention comprises: a contact unit for cutting a substrate by coming into contact with the substrate and applying heat to the substrate; and a drive unit for controlling the contact unit. |
| 申请公布号 |
KR20150057620(A) |
申请公布日期 |
2015.05.28 |
| 申请号 |
KR20130141195 |
申请日期 |
2013.11.20 |
| 申请人 |
KODI-S CO., LTD. |
发明人 |
PARK, CHAN JUNG;KIM, MOON KI |
| 分类号 |
B26F3/08;B26D7/08;B26D7/10 |
主分类号 |
B26F3/08 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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