发明名称 半導体装置
摘要 <p>An object is to provide a semiconductor device having a novel structure. A first wiring; a second wiring; a third wiring, a fourth wiring; a first transistor including a first gate electrode, a first source electrode, and a first drain electrode; a second transistor including a second gate electrode, a second source electrode, and a second drain electrode are included. The first transistor is provided over a substrate including a semiconductor material and a second transistor includes an oxide semiconductor layer.</p>
申请公布号 JP5723922(B2) 申请公布日期 2015.05.27
申请号 JP20130104195 申请日期 2013.05.16
申请人 发明人
分类号 H01L21/8242;H01L21/336;H01L21/8247;H01L27/108;H01L27/115;H01L29/786;H01L29/788;H01L29/792 主分类号 H01L21/8242
代理机构 代理人
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