发明名称 半導体装置の作製方法
摘要 <p>Oxygen is released from the insulating layer, whereby oxygen deficiency in the oxide semiconductor layer and an interface state between the insulating layer and the oxide semiconductor layer can be reduced. Accordingly, a semiconductor device where reliability is high and variation in electric characteristics is small can be manufactured.</p>
申请公布号 JP5723216(B2) 申请公布日期 2015.05.27
申请号 JP20110110530 申请日期 2011.05.17
申请人 发明人
分类号 H01L21/336;H01L21/363;H01L29/786 主分类号 H01L21/336
代理机构 代理人
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