| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To enable a plate like member such as a semiconductor wafer to be supported with high accuracy. <P>SOLUTION: A support apparatus 10 includes placement means 11 having a placement surface 19 on which a semiconductor wafer W is placed and guide means 12 which is projected in a direction away from the placement surface 19 and is positioned at the outer side of the semiconductor wafer W placed on the placement surface 19. The guide means 12 includes a guide part 24, and the guide part 24 gradually inclines as the guide part 24 separates away from the placement surface 19 in a manner that it extends in a direction away from the center of the semiconductor wafer W in a plane view. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
