发明名称 |
High performance liga spring interconnect system for probing application |
摘要 |
A zero insertion force connector (110, 200, 300) comprising a housing (201) including an opening (202) and defining an interior space for receiving a flexible PCB (120) and multiple spring contacts (302) positioned within the interior space. The housing further includes a lid (204) that while opened allow the flexible PCB (120) to be inserted and while closed forces the flexible PCB (120) to abut the spring contacts (302). |
申请公布号 |
EP2876739(A1) |
申请公布日期 |
2015.05.27 |
申请号 |
EP20140194244 |
申请日期 |
2014.11.21 |
申请人 |
TEKTRONIX, INC. |
发明人 |
MCGRATH, JAMES;POLLOCK, IRA;SIMMEN, DAVID |
分类号 |
H01R12/81;H01R12/88 |
主分类号 |
H01R12/81 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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