发明名称 High performance liga spring interconnect system for probing application
摘要 A zero insertion force connector (110, 200, 300) comprising a housing (201) including an opening (202) and defining an interior space for receiving a flexible PCB (120) and multiple spring contacts (302) positioned within the interior space. The housing further includes a lid (204) that while opened allow the flexible PCB (120) to be inserted and while closed forces the flexible PCB (120) to abut the spring contacts (302).
申请公布号 EP2876739(A1) 申请公布日期 2015.05.27
申请号 EP20140194244 申请日期 2014.11.21
申请人 TEKTRONIX, INC. 发明人 MCGRATH, JAMES;POLLOCK, IRA;SIMMEN, DAVID
分类号 H01R12/81;H01R12/88 主分类号 H01R12/81
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