发明名称 閃光放電ランプ点灯装置、光照射器、及びそれを用いた光硬化材料の硬化方法
摘要 <p><P>PROBLEM TO BE SOLVED: To suppress generation of distortion on a wafer at a light irradiation step of a semiconductor wafer and the like, and thereby to improve a yield in semiconductor chip manufacturing. <P>SOLUTION: A flash light discharge lamp lighting device lights a flash light discharge lamp to harden a photo-curing material added to a substrate. The flash light discharge lamp lighting device has: a step-up charging circuit comprising a step-up circuit stepping up an input voltage and a power storage circuit charging an output of the step-up circuit; an initiation circuit performing dielectric breakdown of the flash light discharge lamp to introduce an energy from the power storage circuit to the flash light discharge lamp; and a controller controlling the step-up charging circuit and the initiation circuit to make the flash light discharge lamp perform successive lighting of a plurality of times. The controller is configured to apply an actual irradiation mode where the power storage circuit is charged with a relatively high energy to perform lighting after a weak irradiation mode where the power storage circuit is charged with a relatively low energy to perform lighting, in the successive lighting. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5725412(B2) 申请公布日期 2015.05.27
申请号 JP20110091818 申请日期 2011.04.18
申请人 发明人
分类号 H01J61/80 主分类号 H01J61/80
代理机构 代理人
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