发明名称 選択成膜用マスク
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a mask for selectively depositing a film that can form a stress relaxation opening in a patterning part without increasing a load of dicing to improve a pattern accuracy. <P>SOLUTION: The mask 2 for selectively depositing a film is mounted to a film deposition substrate to deposit a film on the film deposition substrate in a predetermined pattern. The mask 2 for selectively depositing a film includes: an opened pattern corresponding to a pattern of a film; and the stress relaxation opening 30 that is opened at least one of the surfaces thereof and relaxes the stress exerted on the mask 2 for selectively depositing a film during deposition. The stress relaxation opening 30 has a cross-sectional structure configured so that the surface of the film deposition substrate is not directly visible through the stress relaxation opening 30 when the mask 2 for selectively depositing a film is mounted on the film deposition substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5724699(B2) 申请公布日期 2015.05.27
申请号 JP20110153511 申请日期 2011.07.12
申请人 发明人
分类号 C23C14/04;H01L21/285 主分类号 C23C14/04
代理机构 代理人
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