| 摘要 |
Silicone material for protecting electronic devices, which has conformally coating, damp-proofing, vibration absorbing, thermally conducting and electrostatic discharge (ESD) protecting functions, and is cured within 60 seconds, a circuit module using the same, and a manufacturing method of the circuit module. The silicone material includes a base resin, a thermal initiator, and a photoinitiator. In addition, the circuit module includes a printed circuit board having a plurality of circuit patterns formed on an insulating layer, a plurality of electronic devices electrically connected to the circuit patterns by solders, and the silicone material coated on at least one of the circuit patterns, the solders and the electronic devices. Further, the manufacturing method of the circuit module includes providing a printed circuit board having a plurality of circuit patterns formed on an insulating layer and electrically connecting a plurality of electronic devices to the circuit patterns by solders, coating silicone material on at least one of the circuit patterns, the solders and the electronic devices, and curing the silicone material using light and heat. |
