半導体チップの圧縮樹脂封止成形方法及び装置,申请号JP20120020663-传众专利搜索

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发明名称	半導体チップの圧縮樹脂封止成形方法及び装置
摘要
申请公布号	JP5723800(B2)	申请公布日期	2015.05.27
申请号	JP20120020663	申请日期	2012.02.02
申请人		发明人
分类号	B29C43/32;B29C43/18;H01L21/56	主分类号	B29C43/32
代理机构		代理人
主权项
地址

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