发明名称 半導体装置
摘要 <p>A semiconductor device includes a semiconductor substrate, a semiconductor element disposed in the semiconductor substrate, a guard ring surrounding at least a part of a periphery of the semiconductor element, a guard ring terminal coupled with the guard ring, a power supply line divided from a line coupled with a power source and applying a first constant voltage to the semiconductor element based on a voltage generated by the power source, a guard ring terminal fixation line divided from the line coupled with the power source and applying a second constant voltage to the guard ring terminal, a bypass capacitor disposed on the guard ring terminal fixation line so as to be coupled in parallel with the guard ring, and a resistor disposed on the guard ring terminal fixation line between the power source and the bypass capacitor.</p>
申请公布号 JP5724934(B2) 申请公布日期 2015.05.27
申请号 JP20120090391 申请日期 2012.04.11
申请人 发明人
分类号 H01L21/8234;H01L21/336;H01L21/76;H01L21/822;H01L27/04;H01L27/06;H01L27/08;H01L27/088;H01L29/06;H01L29/786 主分类号 H01L21/8234
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