| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide slurry for chemical mechanical polishing, excellent in planarization performance and capable of extremely reducing a step between a stopper film and an insulating film. <P>SOLUTION: The slurry for chemical mechanical polishing includes a polymer (a), a polishing abrasive grain (b) and water (c), and the polymer (a) contains a structural unit of a cyclic oligosaccharide and/or a derivative (a-1) thereof and a structural unit of a compound (a-2) having two or more functional groups capable of reacting with a hydroxyl group. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
