Side vented pressure sensor device

摘要

A semiconductor sensor device has a pressure sensing die and at least one other die mounted on a substrate, and electrical interconnections that interconnect the pressure sensing die and the at least one other die. An active region of the pressure sensing die is covered with a pressure sensitive gel material, and a cap having a cavity is mounted over the pressure sensing die such that the pressure sensing die is positioned within the cavity. The cap has a side vent hole that exposes the gel covered active region of the pressure sensing die to ambient atmospheric pressure outside the sensor device. Molding compound on an upper surface of the substrate encapsulates the at least one other die and at least a portion of the cap.

主权项

1. A method of assembling a semiconductor sensor device, the method comprising:
mounting a pressure sensing die and at least one other die on a substrate; electrically interconnecting the pressure sensing die and the at least one other die; covering an active region of the pressure sensing die with pressure sensitive gel material; mounting a cap having a cavity formed therein over the pressure sensing die, wherein:
the pressure sensing die is positioned within the cavity; andthe cap has a side vent stack formed thereon; encapsulating the at least one other die and at least a portion of the cap with a molding compound on an upper surface of the substrate; and singulating through the substrate and the molding compound such that at least a portion of the side vent stack is severed from the cap, thereby forming a vent opening in the cap that exposes the gel-covered active region of the pressure sensing die to ambient atmospheric pressure outside the sensor device.