| 发明名称 | Merged fiducial for semiconductor chip packages | ||
| 摘要 | Systems, manufactures, methods and/or techniques for a merged fiducial for chip packages are described. According to some embodiments, an integrated circuit package may include a package substrate having a first side and a second side, a plurality of conductive traces coupled to the first side and a plurality of balls disposed on the second side. The balls may be adapted to electrically connect the laminate package to a circuit board. The integrated circuit package may include a plurality of ball pads disposed on the second side, the ball pads being adapted to electrically connect the plurality of balls to the plurality of conductive traces. One or more of the ball pads may be uniquely shaped when compared to the rest of the plurality of ball pads, optionally, to serve as a fiducial to designate an A1 pin or ball of the laminate package. | ||
| 申请公布号 | US9041229(B1) | 申请公布日期 | 2015.05.26 |
| 申请号 | US201213608544 | 申请日期 | 2012.09.10 |
| 申请人 | Amkor Technology, Inc. | 发明人 | Johnson Joseph G. |
| 分类号 | H01L23/544;H01L23/52;H01L23/48;H01L23/485;H01L23/498;H01L23/00 | 主分类号 | H01L23/544 |
| 代理机构 | McAndrews, Held & Malloy | 代理人 | McAndrews, Held & Malloy |
| 主权项 | 1. An integrated circuit package, comprising: a package substrate having a first side and a second side; a plurality of conductive traces coupled to the first side, the conductive traces being adapted to electrically connect to a semiconductor die; a plurality of balls disposed on the second side, the balls being adapted to electrically connect the integrated circuit package to a circuit board; and a plurality of ball pads disposed on the second side, the ball pads being adapted to electrically connect the plurality of balls to the plurality of conductive traces, wherein one or more of the ball pads is uniquely shaped when compared to the rest of the plurality of ball pads and is a fiducial for the integrated circuit package. | ||
| 地址 | Tempe AZ US | ||