Molded interposer package and method for fabricating the same

摘要

A method for fabricating a molded interposer package includes performing a first anisotropic etching process to remove a portion of the metal sheet from a top surface of the metal sheet, thereby forming a plurality of first recesses in the metal sheet, forming a molding material covering the top surface, filling the first recesses, forming a plurality of first via openings in the molding material, wherein the first via openings expose the top surface, forming a plurality of first metal vias in the first via openings and a plurality of first redistribution layer patterns respectively on the first metal vias, performing a second anisotropic etching process to remove a portion of the metal sheet from a bottom surface of the metal sheet until a bottom of the molding material is exposed, and forming a solder mask layer on the molding material, leaving the first redistribution layer patterns exposed.

主权项

1. A method for fabricating a molded interposer package, comprising:
providing a metal sheet having a top surface and a bottom surface; performing a first anisotropic etching process to remove a portion of the metal sheet from the top surface of the metal sheet, thereby forming a plurality of first recesses in the metal sheet; forming a molding material covering the top surface of the metal sheet, filling the first recesses; forming a plurality of first via openings in the molding material, wherein the first via openings expose the top surface of the metal sheet; forming a plurality of first metal vias in the first via openings and a plurality of first redistribution layer patterns respectively on the first metal vias; performing a second anisotropic etching process to remove a portion of the metal sheet from the bottom surface of the metal sheet until a bottom of the molding material is exposed; and forming a solder mask layer on the molding material, leaving the first redistribution layer patterns exposed.