发明名称 Highly reflective coating on LED submount
摘要 A submount for a light emitting stack includes a substrate and a metallization layer having circuit traces and a planar dielectric layer that fills regions between the circuit traces. The planar dielectric layer serves to minimize the amount of light lost/absorbed by the substrate and preferably reflects the internally reflected light back toward the desired light output element. To facilitate efficient manufacture, a dielectric paste is applied over the metallized layer, then planed to expose at least portions of the metal conductors for the subsequent coupling to the light emitting stack. Pedestal elements are preferably provided at select locations on the circuit traces to facilitate this coupling while allowing the remainder of the circuit traces to be covered with the dielectric layer.
申请公布号 US9040332(B2) 申请公布日期 2015.05.26
申请号 US201113878782 申请日期 2011.10.07
申请人 Koninklijke Philips N.V. 发明人 Moran Brendan;Kmetec Jeffrey;Black Iain;Diana Frederic;Rudaz Serge Laurent;Zhang Li
分类号 H01L33/08;H01L33/60;H01L33/50;H01L33/62 主分类号 H01L33/08
代理机构 代理人
主权项 1. A method comprising: providing a plurality of conductive traces on a metallization layer above a substrate, applying a dielectric layer above and between the conductive traces, substantially covering an entire area of the metallization layer above the substrate with the dielectric layer, removing a portion of the dielectric layer to facilitate electrical coupling to the plurality of conductive traces, and providing a light emitting element above the metallization layer, the conductive traces being electrically coupled to the light emitting element, wherein the conductive traces include pedestal elements that are exposed by the removing of the portion of the dielectric layer.
地址 Eindhoven NL