发明名称 Semiconductor device and manufacturing method thereof
摘要 One embodiment of the present invention is to achieve high mobility in a device using an oxide semiconductor and provide a highly reliable display device. An oxide semiconductor layer including a crystal region in which c-axis is aligned in a direction substantially perpendicular to a surface is formed and an oxide insulating layer is formed over and in contact with the oxide semiconductor layer. Oxygen is supplied to the oxide semiconductor layer by third heat treatment. A nitride insulating layer containing hydrogen is formed over the oxide insulating layer and fourth heat treatment is performed, so that hydrogen is supplied at least to an interface between the oxide semiconductor layer and the oxide insulating layer.
申请公布号 US9040989(B2) 申请公布日期 2015.05.26
申请号 US201314021406 申请日期 2013.09.09
申请人 Semiconductor Energy Laboratory Co., Ltd. 发明人 Yamazaki Shunpei
分类号 H01L29/04;H01L31/20;H01L21/336;H01L29/786;H01L21/30;H01L27/12 主分类号 H01L29/04
代理机构 Robinson Intellectual Property Law Office, P.C. 代理人 Robinson Eric J.;Robinson Intellectual Property Law Office, P.C.
主权项 1. A semiconductor device comprising: a first gate electrode; an oxide semiconductor layer over the first gate electrode, the oxide semiconductor layer including a crystal region in which c-axis is aligned in a direction, wherein an angle between the direction and a surface of the oxide semiconductor layer is within a range of 80° to 100°; a second gate electrode over the oxide semiconductor layer; a nitride insulating layer containing hydrogen over the oxide semiconductor layer.
地址 Atsugi-shi, Kanagawa-ken JP