Air-cooling and vapor-condensing door assembly

摘要

A cooling apparatus for an electronics rack is provided which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack.

主权项

1. A cooling apparatus comprising:
a door assembly sized to couple to an electronics rack and be disposed at one of an air inlet side or an air outlet side of the electronics rack, wherein air moves through the electronics rack from the air inlet side to the air outlet side thereof, the door assembly facilitating cooling of one or more electronic components of the electronics rack, and wherein the door assembly comprises:
an airflow opening facilitating ingress or egress of airflow through the electronics rack with the door assembly mounted thereto;an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger to extract heat from the airflow passing thereacross; anda vapor condenser, the vapor condenser being part of the door assembly, and facilitating condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack with the door assembly mounted to the electronics rack and the vapor condenser coupled in fluid communication with the immersion-cooled electronic component section of the electronic rack.