Electronic assembly apparatus and associated methods

摘要

A method of fabricating an electronic assembly includes fabricating first and second interconnects. The first interconnect is adapted to interconnect a first die to a substrate. The second interconnect is adapted to interconnect the first die to a second die. The method further includes assembling the first die, the second die, and the substrate together such that the first die is disposed above the substrate, and the second die is disposed below the first die.

主权项

1. A method of fabricating an electronic assembly, the method comprising:
fabricating, using a photolithography process, a first interconnect comprising a first set of copper pillars, the first interconnect to interconnect a first die to a semiconductor substrate; fabricating, using the photolithography process, a second interconnect comprising a second set of copper pillars, the second interconnect to interconnect the first die to a second die; and assembling the first die, the second die, and the semiconductor substrate together such that the first die is disposed above the semiconductor substrate, and the second die is disposed below the first die.