发明名称 |
Group-III nitride compound semiconductor light-emitting device, method of manufacturing group-III nitride compound semiconductor light-emitting device, and lamp |
摘要 |
A group-III nitride compound semiconductor light-emitting device, a method of manufacturing the group-III nitride compound semiconductor light-emitting device, and a lamp. The method includes the steps of: forming an intermediate layer (12) made of a group-III nitride compound on a substrate (11) by activating and reacting gas including a group-V element with a metal material in plasma; and sequentially forming an n-type semiconductor layer (14), a light-emitting layer (15), and a p-type semiconductor layer (16) each made of a group-III nitride compound semiconductor on the intermediate layer (12). Nitrogen is used as the group-V element, and the thickness of the intermediate layer (12) is in the range of 20 to 80 nm. |
申请公布号 |
US9040319(B2) |
申请公布日期 |
2015.05.26 |
申请号 |
US201113326542 |
申请日期 |
2011.12.15 |
申请人 |
TOYODA GOSEI CO., LTD. |
发明人 |
Yokoyama Yasunori;Miki Hisayuki |
分类号 |
H01L21/02;H01L33/00;B82Y20/00;H01S5/02;H01S5/022;H01S5/042;H01S5/30;H01S5/343 |
主分类号 |
H01L21/02 |
代理机构 |
Sughrue Mion, PLLC |
代理人 |
Sughrue Mion, PLLC |
主权项 |
1. A method of manufacturing a group-III nitride compound semiconductor light-emitting device, comprising steps of:
forming an intermediate layer made of a group-III nitride compound on a substrate by activating and reacting gas including a group-V element with a metal material in plasma; and sequentially forming an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer each made of a group-III nitride compound semiconductor on the intermediate layer, wherein nitrogen is used as the group-V element, the thickness of the intermediate layer is in the range of 20 to 80 nm, the intermediate layer is formed by a sputtering method, an underlying layer included in the n-type semiconductor is formed on the intermediate layer, the underlying layer is formed of a GaN-based compound semiconductor, and the intermediate layer has high crystallinity wherein a half width of an XRC spectrum of the (0002) plane of an undoped GaN layer is less than 150 arcsec, and a half width of an XRC spectrum of the (10-10) plane is less than 350 arcsec. |
地址 |
Aichi JP |