Semiconductor package and method for manufacturing the same

摘要

A semiconductor package includes a semiconductor chip having a front surface and a back surface facing away from the front surface; a through electrode formed in the semiconductor chip and passing through the front surface and the back surface; and a contamination preventing layer formed in the semiconductor chip, the through electrode passing through the contamination preventing layer.

主权项

1. A method for manufacturing a semiconductor package, comprising:
preparing a semiconductor chip which has a front surface and a back surface facing away from the front surface; forming a contamination preventing layer in the semiconductor chip; forming a through electrode from the front surface of the semiconductor chip to a depth that passes through the contamination preventing layer; and removing a portion of the back surface of the semiconductor chip to expose the through electrode.