| 摘要 |
Provided are a dividing method and a dividing apparatus for a wafer laminated body to effectively perform a dry-type division process without using a dicing saw. The present invention relates to a method of diving a wafer laminated body (W) for an image sensor which has a structure where a glass wafer (1) and a silicon wafer (2) are bonded to a resin layer (4) surrounding each photodiode forming region (3). A scribe line (S1) is formed by pressurizing and vibrating a scribing wheel (10) along a division line in the upper part of the glass wafer (1), or relatively moving a diamond point. After that, a groove (S2) is formed by emitting laser along the division line of the outer surface of the silicon wafer (2) and cutting the outer surface of the silicon wafer (2). For examples, the wafer laminated body (W) is bent by the pressure of a pressing member (14) along the scribe line from the outer surface of the glass wafer (1) or silicon wafer (2), so that the glass wafer (1) and the silicon wafer (2) are divided. |
