发明名称 Nonvolatile memory device and method for manufacturing same
摘要 According to one embodiment, a nonvolatile memory device includes a first interconnect, an insulating layer, a needle-like metal oxide, and a second interconnect. The insulating layer is provided on the first interconnect. The needle-like metal oxide pierces the insulating layer in a vertical direction. The second interconnect is provided on the insulating layer.
申请公布号 US9040950(B2) 申请公布日期 2015.05.26
申请号 US201113225926 申请日期 2011.09.06
申请人 Kabushiki Kaisha Toshiba 发明人 Matsuo Kouji
分类号 H01L45/00;H01L27/24 主分类号 H01L45/00
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A nonvolatile memory device, comprising: a first interconnect; an insulating layer provided on the first interconnect; a needle-like metal oxide piercing the insulating layer to extend throughout an entire thickness of the insulating layer in a vertical direction; and a second interconnect provided on the insulating layer; wherein the insulating layer is formed of an oxide, and an absolute value of a change of a Gibbs free energy per mole of oxygen atoms when a metal included in the needle-like metal oxide changes into a metal oxide of the needle-like metal oxide is less than an absolute value of a change of a Gibbs free energy per mole of oxygen atoms when a metal or a semimetal included in the insulating layer changes into the oxide of the insulating layer; and further comprising a lower electrode layer provided between the first interconnect and the insulating layer to contact the insulating layer, the needle-like metal oxide being formed of an oxide of the same type of metal as a metal included in the lower electrode layer.
地址 Tokyo JP