Axiocentric scrubbing land grid array contacts and methods for fabrication

摘要

A contact structure and assembly and a method for manufacturing the same for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.

主权项

1. A method for manufacturing a contact structure for microelectronics manufacturing, comprising:
providing a carrier element defining a first opening therethrough; positioning a molded element on opposite sides of the carrier element by passing the molded element partially through the first opening; coating the molded element with an electrically conductive material; fabricating a helix shaped contact from the electrically conductive material on the opposite sides of the carrier element, the helix shaped contact being positioned over the molded element, the helix shaped contact having a first portion and a second portion on the opposing sides of the carrier element, respectively, and the first and second portions being in minor image relationship to each other; heating the combined helix shaped contact and the molded element such that the molded element is ablated and the helix shaped contact substantially retains the shape of the molded element; positioning at least one contact point on each of the first contact portion and the second contact portion between a pair of insulating substrates including electrically conductive members; and positioning the at least one contact point on each of the first and second contacts portions for electrical contact with respective electrically conductive members to form an electrically conductive package.