Ultrasonic inspection method

摘要

A method for ultrasonically inspecting components with wavy or uneven surfaces. A multi-element array ultrasonic transducer is operated with a substantial fluid layer, such as water, between the array transducer and the component surface. This fluid layer may be maintained by immersing the component in liquid or by using a captive couplant column between the probe and the component surface. The component is scanned, measuring the two dimensional surface profile using either a mechanical stylus, laser, or ultrasonic technique. Once an accurate surface profile of the component's surface has been obtained, data processing parameters are calculated for processing the ultrasonic signals reflected from the interior of the component that eliminate beam distortion effects and reflector mis-location that would otherwise occur due to the uneven surfaces.

主权项

1. A method for ultrasonically inspecting components with uneven surfaces, comprising:
a. providing a fluid coupling of at least several ultrasonic wavelengths thick between a probe that contains an ultrasonic transducer and a component by immersing the component in liquid and providing a space between the transducer and component that allows an uneven surface on the component without contact between the transducer and component, the ultrasonic transducer comprising an array of small unfocused elements with each element producing substantial beam spread; b. measuring the two dimensional surface profile of the component as a function of encoded ultrasonic probe position, wherein measuring the two dimensional surface profile comprises the steps of:
(i) scanning the component, firing each individual ultrasonic element one at a time;(ii) for each firing, simultaneously recording the received reflected ultrasonic waveform from both the surface and interior reflectors from each element in the array; and(iii) processing the collected array of ultrasonic waveform data to sweep an ultrasonic beam in angle at each probe position and, using the known angle and probe position, measure the surface profile of the component; c. calculating signal processing parameters based on the measured surface profile, as a function of the encoded ultrasonic probe position, to eliminate ultrasonic beam distortion; and d. downloading the calculated signal processing parameters to the ultrasonic instrument, to a processing unit or to a data storage device.