| 摘要 |
An objective of the present invention is to uniformly heat a surface of a target substrate when the substrate undergoes a heating process by introducing a microwave into a processing vessel. The microwave heating apparatus (1) radiates a microwave onto a wafer (W) in a processing vessel (10) to heat the wafer (W) and comprises: a substrate holding element (13) disposed inside the processing vessel (10) to hold and rotate the wafer (W); a microwave generator (11) to generate a microwave; and a plurality of microwave entering holes (36) formed on a surface of the processing vessel (10) facing the wafer (W) to introduce the microwave generated from the microwave generator (11) into the processing vessel (10). The microwave entering holes (36) become larger towards the wafer (W). |
