| 摘要 |
The present invention relates to a semiconductor flip chip package which includes a plurality of semiconductor chip bumps which are mounted on a semiconductor chip to protrude in a substrate direction and an interval expansion connecting part which connects the substrate to the semiconductor chip bump. A bump is formed on each of the substrate and the semiconductor chip of a flip chip semiconductor. A bonding intensity is improved by increasing a bonding area of the corresponding bumps. A space between the semiconductor chip and the substrate is sufficiently secured. |
