| 发明名称 | Automated residual material detection | ||
| 摘要 | Methods, systems, and structures for detecting residual material on semiconductor wafers are provided. A method includes scanning a test structure including topographic features on a surface of a semiconductor wafer. The method further includes determining, based on the scanning, that the test structure includes an amount of a residual material of a sacrificial layer that exceeds a predetermined threshold. | ||
| 申请公布号 | US9043743(B2) | 申请公布日期 | 2015.05.26 |
| 申请号 | US201314060098 | 申请日期 | 2013.10.22 |
| 申请人 | International Business Machines Corporation | 发明人 | Maling Jeffrey C.;Stamper Anthony K.;Topic-Beganovic Zeljka |
| 分类号 | G06F17/50;H01L23/58;G01R31/26;H01L21/66;H01L23/544;G01N23/20 | 主分类号 | G06F17/50 |
| 代理机构 | Roberts Mlotkowski Safran & Cole, P.C. | 代理人 | Canale Anthony;Roberts Mlotkowski Safran & Cole, P.C. |
| 主权项 | 1. A method for detecting residual material, comprising: scanning a test structure including a plurality of topographic features on a surface of a semiconductor wafer; and determining, based on the scanning, that the test structure includes an amount of a residual material of a sacrificial layer that exceeds a predetermined threshold, wherein the scanning comprises: scanning the test structure prior to performing any stripping process to remove the sacrificial layer; and scanning the test structure after the stripping process. | ||
| 地址 | Armonk NY US | ||