发明名称 Microstructure manufacturing method
摘要 A microstructure manufacturing method includes forming a layer of a photosensitive resin on a substrate surface having an electrical conductivity, forming a structure of the photosensitive resin by exposing the layer of the photosensitive resin to light and developing the layer of the photosensitive resin to expose a part of the substrate surface, forming a first plated layer on the exposed part of the substrate surface by soaking the structure of the photosensitive resin in a first plating solution, curing the structure of the photosensitive resin after forming the first plated layer, removing at least part of the first plated layer after curing the structure of the photosensitive resin, and forming a second plated layer on a part where the first plated layer is removed, by soaking the structure of the photosensitive resin in a second plating solution different from the first plating solution.
申请公布号 US9040227(B2) 申请公布日期 2015.05.26
申请号 US201213399651 申请日期 2012.02.17
申请人 Canon Kabushiki Kaisha 发明人 Teshima Takayuki;Setomoto Yutaka
分类号 G03F1/58;C25D5/12;G02B5/18 主分类号 G03F1/58
代理机构 Canon U.S.A. Inc., IP Division 代理人 Canon U.S.A. Inc., IP Division
主权项 1. A microstructure manufacturing method comprising: forming a layer of a photosensitive resin on a substrate surface having an electrical conductivity; exposing a pattern on the layer of the photosensitive resin to light; developing the layer of the photosensitive resin to form a structure of the photosensitive resin that exposes a part of the substrate surface; forming a first plated layer on the exposed part of the substrate surface by soaking the structure of the photosensitive resin in a first plating solution; curing the structure of the photosensitive resin by at least one of exposing the structure to light and heating the structure, after forming the first plated layer; removing at least part of the first plated layer after curing the structure of the photosensitive resin; and forming a second plated layer on a part where the first plated layer is removed, by soaking the structure of the photosensitive resin in a second plating solution different from the first plating solution, wherein the second plated layer and any remaining part of the first plated layer form the microstructure, wherein the photosensitive resin is a negative photosensitive resin, and wherein the aspect ratio of a concave portion of the microstructure is 12 or more and 100 or less.
地址 Tokyo JP