Differential signal transmission cable property evaluating mechanism and evaluating method therefor

摘要

A differential signal transmission cable property evaluating mechanism includes a substrate having a signal line pad to be connected with a signal line conductor of a differential signal transmission cable and a ground pad to be connected with a shield conductor of the differential signal transmission cable, a pressing member for pressing the signal line conductor to the signal line pad, a shield conductor holding sheet including an elastic insulating sheet and a metal foil provided over one side of the elastic insulating sheet, the shield conductor holding sheet provided for indirectly connecting the shield conductor and the ground pad to each other by contacting the metal foil with the shield conductor and the ground pad, and a clip for fixing the shield conductor holding sheet.

主权项

1. A differential signal transmission cable property evaluating mechanism, comprising:
a substrate comprising:
a signal line pad to be connected with a signal line conductor of a differential signal transmission cable; anda ground pad to be connected with a shield conductor of the differential signal transmission cable; a pressing member for pressing the signal line conductor into a direct contact with the signal line pad; a pair of shield conductor holding sheets, each comprising an elastic insulating sheet and a metal foil provided over one side of the elastic insulating sheet, the each shield conductor holding sheet provided for indirectly electrically connecting the shield conductor and the ground pad to each other by contacting the metal foil with the shield conductor and the ground pad; a clip for fixing the shield conductor holding sheet onto the substrate; and a notch provided at an edge of the substrate for accommodating a terminal of the differential signal transmission cable, wherein the ground pad comprises plural pads provided on both sides of the notch respectively on both surfaces of the substrate, and wherein the shield conductor is connected to each of the plural pads provided on the both surfaces of the substrate by one pair of the shield conductor holding sheets sandwiching the shield conductor therebetween on the both surfaces of the substrate.