发明名称 |
Electrochemical coupling of metallic biomaterial implants for biological effect |
摘要 |
The invention discloses a novel method of controlling the open circuit potential (OCP) of a medical implant by coupling it with small amounts of metals having a lower OCP than the implant. Coupling of Mg to less than 1% of the surface area of a titanium implant is shown to induce cathodic polarization of the titanium that inhibits cell proliferation at the surface of the implant. Mg—Ti coupling in medical devices promises to attenuate or eliminate potential complications of surgery such as peri-implantitis and bacterial infections at the site of implantation. |
申请公布号 |
US9039764(B2) |
申请公布日期 |
2015.05.26 |
申请号 |
US200912534443 |
申请日期 |
2009.08.03 |
申请人 |
Syracuse University |
发明人 |
Gilbert Jeremy L. |
分类号 |
A61F2/30;A61L31/08;A61L31/16;A61C8/02;A61C8/00;A61F2/28 |
主分类号 |
A61F2/30 |
代理机构 |
Bond Schoeneck & King, PLLC |
代理人 |
Nocilly David L.;McGuire George R.;Bond Schoeneck & King, PLLC |
主权项 |
1. A medical implant, comprising:
a biocompatible material forming a surface for said implant; a metal having a cathodic electrochemical potential embedded in the biocompatible material and inducing a cathodic electrochemical potential at the surface of said implant relative to said biocompatible material in the absence of said metal. |
地址 |
Syracuse NY US |