发明名称 |
Electro-hydrodynamic cooling with enhanced heat transfer surfaces |
摘要 |
The electronic control has an electric control which incorporates circuitry which will generate heat in use. A cooling channel placed in contact with at least one surface on the electric control. The cooling channel has a portion which receives an enhanced heat transfer surface. At least one electrode pair is mounted on an inlet channel portion upstream of the portion of the channel that receives the enhanced heat transfer surface. A source of current is provided for the electrode. The electrode induces an electric field in the inlet channel, to drive a dielectric fluid across the enhanced heat transfer surfaces. |
申请公布号 |
US9038407(B2) |
申请公布日期 |
2015.05.26 |
申请号 |
US201213644105 |
申请日期 |
2012.10.03 |
申请人 |
Hamilton Sundstrand Corporation |
发明人 |
Pearson Matthew Robert;Farzad Mohsen |
分类号 |
F25B21/00;H01L23/473 |
主分类号 |
F25B21/00 |
代理机构 |
Carlson, Gaskey & Olds, PC |
代理人 |
Carlson, Gaskey & Olds, PC |
主权项 |
1. An electronic element and cooling system comprising:
an electric element which will generate heat in use; a cooling channel placed in contact with at least one surface on said electric element, and said cooling channel having a portion receiving an enhanced heat transfer surface; at least one electrode pair mounted on an inlet channel upstream of said portion of said cooling channel receiving said enhanced heat transfer surface, and a source of current for said electrode, said electrode for inducing an electric field in said inlet channel to drive a fluid across said enhanced heat transfer surfaces due to electrohydrodynamic conduction pumping; and wherein a height of said enhanced heat transfer surfaces is defined in a direction measured away from said at least one surface of said electric element and a ratio of said height of said enhanced heat transfer surfaces to a height of said portion of said cooling channel receiving said enhanced heat transfer surfaces is between 0.1 and 1. |
地址 |
Windsor Locks CT US |