发明名称 STRUCTURE FOR CONNECTING COOLING APPARATUS COOLING APPARATUS AND METHOD FOR CONNECTING COOLING APPARATUS
摘要 Since in cooling apparatuses using phase change systems thermal resistance between the cooling apparatuses and heat generating bodies to be cooled increases when trying to obtain high thermal transport performance and sufficient cooling performance is not obtained this structure for connecting a cooling apparatus has: a connecting plate that is provided with an opening; a thin pressing plate that can be elastically deformed; a first fixing unit which fixes the pressing plate and the connecting plate in a state wherein the pressing plate is disposed by covering a heat receiving section that constitutes the cooling apparatus; and a second fixing unit which fixes the connecting plate and a substrate in a state wherein a heat generating body mounted on the substrate and the heat receiving section are disposed in the opening by being in contact with each other.
申请公布号 IN9146DEN2014(A) 申请公布日期 2015.05.22
申请号 IN2014DELNP9146 申请日期 2014.10.31
申请人 NEC CORPORATION 发明人 MATSUNAGA ARIHIRO;YOSHIKAWA MINORU;SAKAMOTO HITOSHI;SHOUJIGUCHI AKIRA;CHIBA MASAKI;INABA KENICHI
分类号 H01L23/40;H05K7/20 主分类号 H01L23/40
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