| 摘要 |
<p>The present invention relates to an adhesive wafer suitable for attachment to the skin or a wound the wafer comprising a dressing sheet comprising a layer of skin friendly adhesive the adhesive layer being provided with a backing layer on the non skin facing surface thereof and a flexible protection layer on the skin facing surface of the adhesive layer the protection layer protecting the adhesive layer before use of the wafer and the protection layer being attached to the adhesive layer in such a way that it is releasable and wherein the protection layer is in the form of a porous material.</p> |
