| 发明名称 |
SYSTEMS AND METHODS FOR VOID REDUCTION IN A SOLDER JOINT |
| 摘要 |
<p>In accordance with one or more aspects a method of reducing void formation in a solder joint may comprise applying a solder paste deposit to a substrate placing a solder preform in the solder paste deposit disposing a device on the solder preform and the solder paste deposit and processing the solder paste deposit and the solder preform to form the solder joint between the device and the substrate. In some aspects the substrate is a printed circuit board and the device is an integrated circuit package.</p> |
| 申请公布号 |
IN3157DEN2014(A) |
申请公布日期 |
2015.05.22 |
| 申请号 |
IN2014DE03157 |
申请日期 |
2014.04.21 |
| 申请人 |
ALPHA METALS INC. |
发明人 |
KOEP PAUL J.;MICHIEL DE MONCHY A;TORMEY ELLEN S. |
| 分类号 |
H05K3/34 |
主分类号 |
H05K3/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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