发明名称 Resistive Random Access Memory (RRAM) with Improved Forming Voltage Characteristics and Method for Making
摘要 The present disclosure provides resistive random access memory (RRAM) structures and methods of making the same. The RRAM structures include a bottom electrode having protruded step portion that allows formation of a self-aligned conductive path with a top electrode during operation. The protruded step portion may have an inclination angle of about 30 degrees to 150 degrees. Multiple RRAM structures may be formed by etching through a RRAM stack.
申请公布号 US2015137059(A1) 申请公布日期 2015.05.21
申请号 US201314081916 申请日期 2013.11.15
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Chen Jonathan Tehan;Chou Chung-Cheng;Lee Po-Hao;Tu Kuo-Chi
分类号 H01L45/00;H01L27/24 主分类号 H01L45/00
代理机构 代理人
主权项 1. A resistive random access memory (RRAM), comprising: a bottom electrode having a protruded step portion; a resistive material layer conformally covering the protruded step portion of the bottom electrode; and a top electrode over the resistive material layer.
地址 Hsin-Chu TW